Through-Hole and Surface-Mount Soldering

Course Description

EET1610C is a combined lecture and laboratory course ("C" lab indicator per the Florida Statewide Course Numbering System) designed for electronic technicians. The course covers high-reliability through-hole soldering techniques, current industry soldering inspection techniques, electrostatic discharge (ESD) awareness and prevention, introductory surface-mount techniques, and an introduction to rework and repair. Students gain hands-on experience in a fully equipped soldering laboratory, progressing from practice boards to actual circuit board assembly projects. This course serves as a prerequisite for all subsequent IPC certification courses in the Electronic Engineering Technology program.

Learning Outcomes

Required Outcomes

Upon successful completion of this course, students will be able to:

• Demonstrate high-reliability through-hole soldering techniques that meet current industry workmanship standards.
• Apply electrostatic discharge (ESD) awareness and prevention practices to protect electronic assemblies in the workplace.
• Perform visual inspection of solder joints and assemblies using current industry soldering inspection criteria.
• Identify and correctly handle through-hole components, including proper lead preparation and component mounting.
• Execute introductory surface-mount technology (SMT) soldering techniques for placement and attachment of surface-mount devices on printed circuit boards.
• Perform basic rework and repair operations on printed circuit board assemblies using appropriate tools and techniques.
• Identify and use standard soldering tools and equipment, including soldering irons, tips, solder types, and flux, appropriate for through-hole and SMT applications.
• Demonstrate acceptable PCB assembly and solder workmanship consistent with industry standards for circuit board assembly.

Optional Outcomes

The following outcomes may be addressed at the instructor's discretion or depending on program pathway:

• Interpret and apply IPC J-STD-001 material, process, and verification requirements for soldered assemblies.
• Differentiate between Class 1, Class 2, and Class 3 product classifications and their respective acceptability criteria.
• Demonstrate proficiency with lead-free solder alloys and understand the implications of lead-free soldering processes.
• Apply wire preparation and terminal assembly techniques including stripping, tinning, and termination to applicable standards.
• Use optical inspection tools and statistical process control (SPC) concepts in a production inspection context.

Major Topics

Required Topics

The following topics are covered across all known Florida college offerings of this course:

• Safety and Lab Orientation — Personal protective equipment, soldering lab safety rules, handling of hazardous materials (flux fumes, solder), and workstation setup.
• Electrostatic Discharge (ESD) Control — Sources and effects of ESD, ESD-safe handling procedures, grounding, wrist straps, and workstation requirements per industry standards.
• Solder Theory and Materials — Composition and properties of solder alloys (leaded and lead-free), flux types and functions, solderability, solder melting points, and wetting characteristics.
• Soldering Tools and Equipment — Selection and care of soldering irons, tip maintenance, temperature-controlled stations, desoldering tools, and vacuum extraction equipment.
• Electronic Component Identification — Recognition and classification of through-hole and surface-mount components including resistors, capacitors, diodes, transistors, and integrated circuits.
• Through-Hole Soldering Techniques — Lead preparation, component mounting, hand soldering of PTH (pin-through-hole) connections, inspection of through-hole solder joints, and desoldering/rework.
• Industry Soldering Inspection Techniques — Visual inspection criteria for acceptable and defective solder joints, common defects (bridges, cold joints, insufficient fill, excess solder), and inspection skill development.
• Introduction to Surface-Mount Technology (SMT) — Overview of SMT processes, component types (chip resistors, SOTs, SOICs, fine-pitch devices), placement techniques, and hand soldering of surface-mount components.
• Introduction to Rework and Repair — Desoldering methods, component removal and replacement techniques for both PTH and SMT, and basic PCB repair procedures.
• PCB Assembly and Workmanship Standards — Circuit board assembly sequence, handling and storage of PCBs, and demonstration of industry-acceptable solder workmanship on a functional circuit board project.

Optional Topics

The following topics may be included at the instructor's discretion to enrich the course or support pathway alignment:

• IPC Standards Overview — Introduction to IPC as an organization, key standards (IPC J-STD-001, IPC-A-610), and their role in electronics assembly manufacturing.
• Wire and Terminal Assembly — Wire preparation, stripping, tinning, and soldering to terminals per J-STD-001 criteria.
• PCB Requirements and Adhesives — Bare PCB damage criteria, conformal coating, encapsulation, and staking adhesives.
• Lead-Free Soldering Processes — Differences between leaded and lead-free alloys, process adjustments for lead-free conversion, and environmental compliance (RoHS).
• Cleaning Procedures — Post-soldering cleaning requirements, flux residue management, and contamination prevention on PCB assemblies.
• Automated Soldering Processes — Introductory overview of wave soldering, reflow soldering, and solder paste application as context for hand soldering operations.

Resources & Tools

• Primary Standards Reference: IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies (current revision) — the preeminent industry authority for electronics assembly manufacturing worldwide.
• Inspection Reference: IPC-A-610, Acceptability of Electronic Assemblies — used to understand visual acceptance criteria for solder joints.
• Lab Equipment: Temperature-controlled soldering stations, desoldering vacuum tools, rework stations (hot-air), magnification/optical inspection tools, ESD-safe workstations, and grounding equipment.
• Consumables: Leaded and lead-free solder wire, flux, solder wick (desoldering braid), practice and functional printed circuit boards, through-hole and SMT component kits.
• Personal Protective Equipment (PPE): Safety glasses, fume extractors, and ESD wrist straps.
• Reference Texts: IPC course handbooks; manufacturer datasheets for components used in lab projects.

Career Pathways

Successful completion of EET1610C prepares students for entry-level roles in Florida's electronics manufacturing and defense/aerospace sectors — including the Florida Technology Corridor — and provides the prerequisite foundation for advanced IPC certification courses:

• Electronics Assembler / Solder Technician — PCB assembly in electronics manufacturing, contract manufacturing services (CMS), and OEM production environments.
• Electronics Repair Technician — Bench-level rework and repair of electronic assemblies in commercial and industrial settings.
• Quality Control / Inspection Technician — Visual inspection of soldered assemblies to IPC-A-610 acceptability standards.
• Aerospace and Defense Electronics Technician — High-reliability soldering for Class 3 products in aerospace, defense, and space applications (particularly relevant to Florida's Space Coast region).
• Pathway to Advanced IPC Certifications: EET1610C is the prerequisite for EETC 1611 (IPC J-STD-001 Certification), EETC 2620 (Advanced Surface-Mount Soldering / IPC-7711/7721), EETC 1612 (Cable and Wire Harness / IPC/WHMA-A-620), and EET 2621 (Soldering Inspections / IPC-A-610).

Special Information

Certification Preparation

EET1610C is designed as the foundational prerequisite for all IPC certification courses offered through Florida college Electronics Engineering Technology programs. While this course itself does not award an IPC certification, it directly prepares students for:

• IPC J-STD-001 Certified IPC Specialist (CIS) — the internationally recognized standard for soldered electrical and electronic assemblies, pursued through the follow-on course EETC 1611.
• IPC-A-610 Acceptability of Electronic Assemblies — pursued through EET 2621 after completing the IPC J-STD-001 sequence.
• IPC-7711/IPC-7721 Rework and Repair CIS — advanced rework certification pursued through EETC 2620.

IPC certifications are industry-recognized credentials valid for two years, widely required by OEMs, electronics manufacturers, and defense contractors. Students seeking certification must demonstrate proficiency in both written examinations and hands-on soldering practical assessments.

Lab Requirement

The "C" suffix in the course number (EET1610C) designates this as a combined lecture and laboratory course per the Florida Statewide Course Numbering System. Attendance in all lab sessions is essential; students must demonstrate hands-on soldering workmanship skills in addition to passing written assessments. A significant portion of course time (typically 60–75%) is spent in hands-on laboratory practice.