Semiconductor Characterization and Packaging

Course Description

ETS2165C – Semiconductor Characterization and Packaging is a combined lecture and laboratory course (indicated by the "C" suffix in the Florida Statewide Course Numbering System) that introduces students to the fundamental principles of semiconductor packaging and device characterization. The course focuses on the basic concepts, materials, and packaging processes used to protect and enhance the performance of semiconductor devices. Students develop practical skills by applying theoretical knowledge in hands-on laboratory experiments, covering electrical, thermal, and material characterization techniques alongside core packaging assembly processes. This course is part of the Semiconductor Engineering Technology program and prepares students for technician-level roles in Florida's growing semiconductor and microelectronics industry.

Learning Outcomes

Required Outcomes

Upon successful completion of this course, students will be able to:

Explain fundamental concepts and terminology associated with semiconductor packaging and its importance in modern electronics.
Identify and describe the electrical, thermal, and mechanical properties of semiconductor packaging materials and substrates.
Describe the major package assembly processes, including die attach, wire bonding, encapsulation, and singulation.
Classify standard package types (e.g., DIP, QFP, BGA, CSP, WLP) and select appropriate packaging options based on application requirements.
Perform basic electrical characterization of semiconductor devices, including I-V and C-V measurements.
Apply cleanroom protocols, safety practices, and electrostatic discharge (ESD) precautions in a laboratory environment.
Demonstrate proficiency in semiconductor materials handling and sample preparation in accordance with industry standards.
Identify common failure mechanisms and reliability concerns in semiconductor packages.
Use standard test and measurement equipment to characterize packaged semiconductor devices.
Demonstrate professional and ethical responsibilities required by the semiconductor industry.

Optional Outcomes

Depending on institutional emphasis and available equipment, students may also:

Analyze thermal management strategies and perform basic thermal resistance measurements on packaged devices.
Evaluate advanced packaging technologies such as 3D packaging, System-in-Package (SiP), and heterogeneous integration.
Perform non-destructive inspection of packages using acoustic microscopy (C-SAM) or X-ray imaging.
Interpret reliability test data from burn-in, thermal cycling, and moisture resistance tests.
Apply statistical process control (SPC) concepts to semiconductor packaging quality metrics.

Major Topics

Required Topics

Introduction to Semiconductor Packaging – History and evolution of packaging, role of the package in the semiconductor supply chain, package functions (electrical, thermal, mechanical protection).
Semiconductor Materials and Substrates – Silicon, compound semiconductors, lead frames, organic and ceramic substrates; material properties relevant to packaging.
Package Types and Architectures – Through-hole (DIP, TO) vs. surface-mount (QFP, SOIC); area-array packages (BGA, LGA); chip-scale packages (CSP); wafer-level packaging (WLP).
Die Preparation and Attach – Wafer dicing/singulation methods; die attach materials (epoxy, solder, eutectic); die bonding processes.
Interconnect Technologies – Wire bonding (ball, wedge); flip-chip / solder bump interconnects; tape-automated bonding (TAB).
Encapsulation and Molding – Epoxy mold compounds; transfer molding; glob top and underfill processes; hermetic sealing.
Electrical Characterization – I-V curve tracing; C-V measurement; continuity and parametric testing; use of semiconductor parameter analyzers.
Thermal Characterization – Thermal resistance (θJA, θJC); junction temperature measurement; heat spreaders and thermal interface materials.
Reliability and Failure Mechanisms – Common failure modes (delamination, wire bond fatigue, corrosion, ESD damage); overview of JEDEC reliability test standards.
Cleanroom and ESD Safety – Cleanroom classifications; gowning and contamination control; ESD fundamentals and protection practices.
Laboratory Practice – Hands-on experiments in device characterization, package assembly steps, and inspection; use and maintenance of lab equipment.

Optional Topics

Advanced Packaging Technologies – 3D stacked die, Through-Silicon Vias (TSVs), System-in-Package (SiP), heterogeneous integration, chiplets.
Non-Destructive Inspection Techniques – Acoustic microscopy (C-SAM), 2D/3D X-ray computed tomography, optical microscopy for package analysis.
Mechanical Characterization – Stress and strain in package structures; coefficient of thermal expansion (CTE) mismatch; thermomechanical reliability modeling.
Statistical Process Control – Control charts, Cpk, yield analysis applied to packaging lines.
Environmental and Industry Regulations – RoHS/WEEE compliance; lead-free soldering; JEDEC and IPC standards overview.
Emerging Materials – Wide-bandgap semiconductors (SiC, GaN) and their packaging requirements for power and high-frequency applications.

Resources & Tools

Textbook: Semiconductor Advanced Packaging by John H. Lau (recommended reference aligned with Florida college semiconductor programs).
Supplemental Reference: Semiconductor Material and Device Characterization by Dieter K. Schroder, 3rd ed. (Wiley).
Laboratory Equipment: Semiconductor parameter analyzer (I-V/C-V), probe station, wire bonder, optical microscope, ESD workstation, cleanroom personal protective equipment (PPE).
Software Tools: Data acquisition and plotting software (e.g., LabVIEW, MATLAB, or equivalent) for characterization data analysis.
Industry Standards: JEDEC reliability test standards; IPC-7711/7721 rework standards; SEMI standards for wafer handling.
Online Resources: SEMI.org training modules; NSF Florida Semiconductor Engine workforce resources; Valencia College Semiconductor Engineering Technology program materials.

Career Pathways

Completion of ETS2165C supports entry-level employment and career advancement in Florida's expanding semiconductor and microelectronics sector. Relevant roles include:

Semiconductor Packaging Technician – Performs die attach, wire bonding, encapsulation, and inspection on production lines at OSATs (Outsourced Semiconductor Assembly and Test) or IDMs.
Semiconductor Equipment Technician – Operates and maintains packaging and characterization equipment in cleanroom environments.
Quality/Reliability Technician – Conducts incoming and outgoing quality inspection and reliability testing of packaged devices.
Process Technician – Microelectronics – Supports wafer-level and panel-level packaging processes at advanced packaging facilities.
Cleanroom Facility Operator/Supervisor – Manages cleanroom operations and contamination control in semiconductor manufacturing settings.

This course is a key component of the Semiconductor Engineering Technology A.S. degree at Valencia College, which provides a pathway to the Bachelor of Science in Semiconductor Engineering Technology at the University of Central Florida (launch pending Florida Board of Governors approval). Industry employers in the NeoCity/Osceola County technology corridor and across Florida's aerospace, defense, and electronics sectors actively recruit graduates of this program.

Special Information

Industry Certification Preparation

Course content is aligned with skills recognized by major semiconductor workforce bodies. Students are encouraged to pursue the following credentials as they complete the A.S. program:

IPC Certified Electronics Technician (CET) – Validates competency in electronics assembly, soldering, and inspection consistent with packaging lab skills.
SEMI Semiconductor Manufacturing Fundamentals – Industry-recognized credential for entry-level semiconductor manufacturing roles.
ESD Association (ESDA) Certification – Recognized credential for ESD control in semiconductor manufacturing environments.

Program Context

ETS2165C is listed in the Valencia College Semiconductor Engineering Technology program as a required course within the intermediate-level core sequence. Successful completion (grade of C or better) of ETS 2161C – Introduction to Cleanroom Operation is a prerequisite. ETS2165C is also listed as a prerequisite for the ETS 2940C – Semiconductor Manufacturing Practicum (internship), reinforcing its role as a gateway to industry-based experiential learning. The "C" designation in the course number indicates a combined lecture and laboratory format meeting in the same location at the same scheduled time, per Florida SCNS policy.